中壽 Mobile01的問題，透過圖書和論文來找解法和答案更準確安心。 我們找到下列包括價格和評價等資訊懶人包

一個無線感測網路壽命規劃快速計算方法

為了解決中壽 Mobile01的問題，作者朱恆毅 這樣論述：

在網路普及的現今，物聯網、智慧化建築等等是大家一直以來關注的重大議題，而這些想法的實踐，必然要用到許多監控設備，需要使用到大量的感測器，本論文提出一種方法解決無線感測網路(WSN)的壽命問題，WSN是利用一種小型且低耗的感測器，大量布置在任何地形，用途廣泛，可以用做家庭監控、環境地形監測等，功能不勝枚舉，而這些感測器最大的問題便在於使用的壽命，由於要達到無線的便利性，這些感測器只能用安裝電池的方式維持能量的供給，而在許多情況下(比如地形限制)是沒有辦法更換電池的，所以如何使得WSN的壽命最大化成了一大問題，故我們決定將感測器排程，set K-cover problem是一種感測器排程的WSN

問題，我們將其加入能量元素，延伸為本論文要處理的壽命規劃問題，而壽命規劃問題可以轉換為大型的線性規劃問題，在測試數據中，我們改良Column Generation所得到的壽命規劃演算法與Simplex method相比，前者只需後者不到2%的時間可得精確解，在WSN範例中，壽命規劃演算法花費的時間約略為Simplex method時間的1/3，我們除了得到最長壽命外，使用螞蟻演算法對壽命規劃問題得到的解進行排序，以此節省可能的能量消耗，也能得知內部運作情況，更符合產業利用型態。

ResearchofDynamicAnalysisandImpactLifePredictionTheoryforWaferLevelPackageSubjectedtoDropImpact

為了解決中壽 Mobile01的問題，作者周展延 這樣論述：

Accompanying the increasing popularity of portable and handheld products, high reliability and high resistance of drop impact capability of handheld products becomes a great concern for semiconductor and electronic product manufacturers. It is more and more important to study the dynamic response o

f packages during the mechanical shock caused by customer usage in portable devices and mobile applications.In this research, the board-level drop test, failure analysis, dynamic simulation, and the theory of metal trace failure prediction under board-level drop test are established. Afterward, the

structural optimal design is carried out to improve the drop test performance of packages. The stress-buffer-enhanced package with fan-out capability which can meet the high requirement of drop-test performance is applied as a test vehicle. Both drop test experiment and numerical simulation were per

formed. This package is provided with a thick and soft dielectric layer to absorb the impact loading to protect the solder joints. However, the meal traces within stress buffer layer suffered relatively larger deformation because of the greatly deformed dielectric layer. Fatigued metal traces in pac

kages instead of solder joint fractures are observed to be the reason of failure during board level drop test. The fatigued trace line is the critical failure mode to be investigated in this research.This study intends to develop a reliable impact life prediction model for metal trace which has beco

me an imperative in estimating the performance of packages subjected to the drop impact. Through the proposed impact life prediction model, one can quantitatively determine the drop impact performance of a specified package. During the development of impact life prediction model, several drop test s

imulations were conducted to elucidate the mechanical behavior of the test board and packages during the blink of impact. Unlike the thermal cycle test, simulation results indicate that the dynamic response of the drop impact is irregular and not cyclic. As such, the concept of cumulative damage is

considered in the life prediction model. Results show that the cumulative plastic strain is suitable for the impact life prediction model. The reason is that the drop test failure belongs to low cycle fatigue which is dominated by plastic strain. There is a good correlation between impact life predi

cted by simulations and measured by experiments. Based on the impact life prediction model, designers may execute more computational experiments in order to accelerate the time-to-market procedures.Following, the structural design of the stress-buffer-enhanced package is accomplished. It is known th

at the failure mode of this package focuses on the metal trace fatigue. As a result, the trace layout design becomes an important topic in this study. In the design processes, first a proper trace layout design is recommended, and then several parametric studies are conducted to clarify the design t

rend and then obtain an optimal structure parameter. Finally, the structural designs, the sandwich structure, and the small chip size design, based on the stress-buffer-enhanced package are proposed to further increase the reliability under drop impact.In this research, the theory of trace fatigue p

rediction under drop impact, based on the cumulative damage theory, is accomplished. Results show that the prediction model is capable to make a good estimation of drop performance. Besides, the design procedures proposed in this research are helpful on saving experimental cost and accelerating time

-to-market processes.