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Practical Binary Analysis: Build Your Own Linux Tools for Binary Instrumentation, Analysis, and Disassembly

為了解決Zeus Custom的問題，作者Andriesse, Dennis 這樣論述：

Stop manually analyzing binary Practical Binary Analysis is the first book of its kind to present advanced binary analysis topics, such as binary instrumentation, dynamic taint analysis, and symbolic execution, in an accessible way.As malware increasingly obfuscates itself and applies anti-analysis

techniques to thwart our analysis, we need more sophisticated methods that allow us to raise that dark curtain designed to keep us out--binary analysis can help. The goal of all binary analysis is to determine (and possibly modify) the true properties of binary programs to understand what they real

ly do, rather than what we think they should do. While reverse engineering and disassembly are critical first steps in many forms of binary analysis, there is much more to be learned. This hands-on guide teaches you how to tackle the fascinating but challenging topics of binary analysis and instrume

ntation and helps you become proficient in an area typically only mastered by a small group of expert hackers. It will take you from basic concepts to state-of-the-art methods as you dig into topics like code injection, disassembly, dynamic taint analysis, and binary instrumentation. Written for sec

urity engineers, hackers, and those with a basic working knowledge of C/C++ and x86-64, Practical Binary Analysis will teach you in-depth how binary programs work and help you acquire the tools and techniques needed to gain more control and insight into binary programs. Once you've completed an intr

oduction to basic binary formats, you'll learn how to analyze binaries using techniques like the GNU/Linux binary analysis toolchain, disassembly, and code injection. You'll then go on to implement profiling tools with Pin and learn how to build your own dynamic taint analysis tools with libdft and

symbolic execution tools using Triton. You'll learn how to: - Parse ELF and PE binaries and build a binary loader with libbfd- Use data-flow analysis techniques like program tracing, slicing, and reaching definitions analysis to reason about runtime flow of your programs- Modify ELF binaries with te

chniques like parasitic code injection and hex editing- Build custom disassembly tools with Capstone- Use binary instrumentation to circumvent anti-analysis tricks commonly used by malware- Apply taint analysis to detect control hijacking and data leak attacks- Use symbolic execution to build automa

tic exploitation tools With exercises at the end of each chapter to help solidify your skills, you'll go from understanding basic assembly to performing some of the most sophisticated binary analysis and instrumentation. Practical Binary Analysis gives you what you need to work effectively with bina

ry programs and transform your knowledge from basic understanding to expert-level proficiency. Dennis Andriesse has a Ph.D. in system and network security and uses binary analysis daily in his research. He is one of the main contributors to PathArmor, a Control-Flow Integrity system that defends a

gainst control-flow hijacking attacks such as ROP. Andriesse was also one of the attack developers involved in the takedown of the GameOver Zeus P2P botnet.

Zeus Custom進入發燒排行的影片

以大氣電漿噴射束改質高分子複合材表面應用於無電鍍銅製程之研究

為了解決Zeus Custom的問題，作者康晟恩 這樣論述：

第一章 緒論 11.1 前言 11.2 研究動機 3第二章 文獻回顧 52.1 無電鍍法 52.1.1 無電鍍法基本介紹 52.1.2 無電鍍銅液組成與特性 62.1.3 無電鍍銅鍍液反應及觸媒催化機制 82.1.4 錫鈀膠組成及活化之步驟與原理 102.1.5 無電鍍法應用與分析 102.2 電漿簡介 132.2.1 電漿基本介紹 132.2.2 電漿反應機制 132.2.3 電漿系統分類 152.2.4 常壓電漿工作型

態分類 172.2.5 常壓電漿噴束激發型式 192.2.6 常壓電漿噴射束與表面改質 212.2.7 電漿氣體效應 252.3 工業塑料簡介 292.3.1 工程塑料種類 292.3.2 LCP簡介 302.3.3 極性與非極性 332.3.4 水接觸角與表面自由能 342.3.5 塑料表面改質原因與方法介紹 352.3.6 電漿改質高分子之原理 40第三章 實驗流程與設備 423.1 實驗總覽 423.2 實驗藥品與設備 433.

2.1 實驗藥品 433.2.2 實驗儀器 443.3 實驗設備 443.3.1 常壓電漿噴射束 443.4 檢測儀器與分析 463.4.1 光放射光譜儀(OES) 463.4.2 熱重分析儀(TGA) 473.4.3 水滴接觸角儀(WCA) 483.4.4 自由基定量分析(DPPH) 483.4.5 紫外光/可見光光譜儀(UV_VIS) 493.4.6 光學顯微鏡(OM) 503.4.7 場發射掃描式電子顯微鏡(FE-SEM) 513.4.8

傅立葉轉換紅外線光譜儀(FTIR) 523.4.9 原子力顯微鏡(AFM) 533.4.10 百格刀(CCT) 563.4.11 拉拔測試儀(POT) 573.4.12 四點探針(4-point probe) 583.4.13 X射線螢光光譜儀(XRF) 593.4.14 X射線繞射儀(XRD) 603.5 實驗製程 623.5.1 基材前處理 623.5.2 電漿處理 623.5.3 化學蝕刻處理 633.5.4 活化與速化處理 643.5.5 無電

鍍銅處理 65第四章 結果與討論 664.1 LCP與常壓電漿噴射束基本性質測定 664.1.1 TGA熱重分析 664.1.1 常壓電漿噴射束長度與溫度測定 674.1.2 OES常壓電漿噴射束物種測定 674.2 LCP經粗化後之表面特性測定 704.2.1 WCA親水性與老化分析 704.2.2 表面自由能分析 724.2.3 FTIR表面化學元素測定 754.2.4 DPPH自由基數量測定 774.2.5 OM表面形貌分析 794.2.6 SE

M表面形貌分析 814.2.7 AFM表面粗糙度分析 844.3 銅鍍層之特性測定 884.3.1 EDX表面化學元素分析 884.3.2 XRD表面化學元素分析 884.3.3 XRF薄膜厚度與元素分析 914.3.4 四點探針電阻測量 914.3.5 百格刀附著測試 944.3.6 拉拔附著測試 954.3.7 SEM撕裂面形貌分析 984.3.8 電漿處理之化學鍍流程機制 101第五章 結論 104第六章 未來展望 106第七章 參考

資料 107