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Reliability and Failure Analysis of High Power Led Packaging

為了解決failure材料的問題，作者Tan, Cher Ming,Singh, Preetpal 這樣論述：

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliabi

lity standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environment

al conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation,

the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress con

ditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.

failure材料進入發燒排行的影片

雙酚A-甲基丙烯酸縮水甘油酯與甲基丙烯酸-2-羥基乙酯光固化樹脂之結構與性質研究

為了解決failure材料的問題，作者林冠穎 這樣論述：

本研究以不同比例的進料bis-phenol A diglycidyl methacrylate（BisGMA）及2-hydroxyethyl methacrylate（HEMA），使用2,2-Diethoxy-1-phenylethanone (DEAP)為光起始劑，添加不同含量的silica，並以紫外光聚合固化，討論不同BisGMA/HEMA進料比及silica添加量對反應轉化率，交聯網路結構與性質的影響。　　藉由13C液態及固態核磁共振儀得知，高分子中BisGMA的含量隨著BisGMA進料量增加而上升。由FTIR發現雙鍵轉化率隨BisGMA含量增加而上升。壓縮模數隨BisGMA進料量增加

而上升，交聯密度會增加，且網路中物理纏結的密度（Ns）和網路中化學交聯的密度（Nc）都會增加，表示BisGMA的添加同時有助於物理性及化學性的交聯。此外，利用交聯密度與高分子吸水率可計算得出水和高分子間交互作用參數（χ），χ值越大，平衡含水率越低。固化體積收縮率隨BisGMA的進料量增加而下降，因BisGMA比HEMA帶有較多苯環上的不飽和鍵。由TGA實驗發現熱裂解溫度隨BisGMA含量增加而提高，因高分子單體單位中BisGMA的分子結構帶有兩個苯環，與HEMA相比耐熱溫度較高。由動態機械分析發現儲存模數與玻璃轉移溫度(Tg)皆隨BisGMA進料量增加而上升，且玻璃轉移溫度(Tg)隨轉化率增加

而上升。接觸角隨BisGMA進料量增加而上升，因BisGMA較HEMA相對疏水。黏著強度隨BisGMA的進料量增加而上升，且樹脂的破壞模式為內聚破壞(cohesive failure)。材料Vickers硬度隨著BisGMA進料量增加而上升。　　另一方面添加silica的高分子，轉化率隨添加量增加而下降，且添加量較多時在SEM下發現silica粒子產生聚集。添加量增加，平衡含水率下降及接觸角度上升，因在高分子中添加的silica為疏水型的二氧化矽。除此之外，silica添加量增加，可提升材料的壓縮模數、交聯密度及材料Vickers硬度，且網路中物理纏結的密度（Ns）和網路中化學交聯的密度（Nc

）都會增加。而silica含量增加時，固化體積收縮率會降低。在高分子中添加無機物時，因碳化的高分子受二氧化矽影響，而堆積於二氧化矽的表面，使殘餘率提高。另外，在高分子中添加適量的無機物可以提高其儲存模數與玻璃轉移溫度(Tg)。而高分子的黏著強度隨silica添加量增加而降低。　　實驗結果得知當改變BisGMA/HEMA進料比及silica含量時，會影響高分子的網路結構，進而影響到膨潤交聯產物的交聯密度、力學性質、水與高分子的交互作用，及影響乾交聯產物的動態機械性質及熱性質、黏著強度、硬度等性質。 

Wear in Advanced Engineering Applications and Materials

為了解決failure材料的問題，作者 這樣論述：

Wear is one of the main reasons mechanical components and materials become inoperable, rendering enormous costs to society over time. Estimating wear allows engineers to predict the useful life of modern mechanical elements, reduce the costs of inoperability, or obtain optimal designs (i.e. selec

ting proper materials, shapes, and surface finishing according to mechanical conditions and durability) to reduce the impact of wear.Wear in Advanced Engineering Applications and Materials presents recent computational and practical research studying damage and wear in advanced engineering applicati

ons and materials. As such, this book covers numerical formulations based on the finite element method (FEM) -- and the boundary element method (BEM) -- as well as theoretical and experimental research to predict the wear response or life-limiting failure of engineering applications.